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专利名称：Semiconductor chip assembly with chip in
substrate cavity
发明人：Chia-Chung Wang,Charles W. C. Lin申请号：US10653723申请日：20030902公开号：US06876072B1公开日：20050405
专利附图：
摘要：A semiconductor chip assembly includes a semiconductor chip that includes firstand second opposing major surfaces, wherein the first surface of the chip includes aconductive pad, a substrate that includes first and second opposing major surfaces,
wherein the first and second surfaces of the substrate include a conductive terminal and adielectric base, the conductive terminal extends through the dielectric base to the firstand second surfaces of the substrate, a cavity extends from the first surface of thesubstrate into the substrate, the first surfaces of the chip and the substrate face in a firstdirection, the second surfaces of the chip and the substrate face in a second direction,and the chip extends into the cavity, a conductive trace in an electrically conductive pathbetween the conductive terminal and the pad, and an adhesive disposed between theconductive trace and the chip, the conductive trace and the substrate, and the chip andthe substrate.
申请人：Chia-Chung Wang,Charles W. C. Lin
地址：Hsinchu TW,Singapore SG
国籍：TW,SG
代理人：David M. Sigmond
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