VJ Soldering Recommendations
Vishay Vitramon
Multilayer Ceramic Chip Capacitors
Speciality Products
SOLDERING RECOMMENDATIONS
1. Termination Selection:
A. Our tin-plated termination (terminations code “X”) isrecommended for all attachment methods which use solder.Vishay Vitramon termination code “X” has a nickel barrierlayer to prevent leaching of silver during the wave solderprocess.
B. Palladium silver (termination code “F”) is the terminationfor conductive epoxy installation used for hybridapplications.
C. Tin/Lead termination with a minimum 4 % lead is availablefor Military, Aerospace and HiRel applications.2. Chip Size vs. Solder Profile:
A. 0402, 0603, 0612, 0805 1206 and 1210 (thickness
≤ 0.049\shown on the following page.
Larger 1210 (thickness > 0.049\≥ 1808 should only be used in reflow or vapor phasesoldering.
B. Solder profiles should be properly controlled to minimizeany thermal shock to the capacitor(s).
(See recommended solder profiles on the following page.)3. Soldering Flux:
Use mildly activated rosin flux RMA or RA types or lowresidue liquid fluxes (no-clean flux). Flux residues fromno-clean flux can be removed with aqueous cleaners.During wave soldering ensure that the majority of solventsare removed at preheat.4. Solder Type:
Sn60, Sn62 or Sn63 is preferred.
No lead containing solder material can be used. For example: SnAgCu5. Soldering Techniques:
Follow the soldering curves shown on next page.
8. Cleaning:
Selection of an appropriate cleaning solvent is dependentupon the type of flux used. Cleaning in alcohol, water,hydrocarbons or any of the common, halogenated degreasersolvents is not detrimental to Vishay Vitramon chipcapacitors.
6. Soldering With a Solder Iron:
Attachment by soldering iron is not recommended - (Reflow,wave or vapor phase systems are recommended) however,if used, the following precautions should be followed:A. Preheat the chip capacitor to + 150 °C minimum. Use hotplate or hot air flow for preheat.
B. Use a low wattage temperature controlled iron (30 wattsmaximum).
C. Use the lowest tip temperature setting possible (+ 280 °Cmaximum) and a maximum soldering time of 5 seconds.D. Use a soldering tip no greater than 0.120\" [3.0 mm] indiameter. Apply the transmission of heat through thesoldering material.
E. When removal of chip capacitor is necessary, a hot airpencil is the preferred tool.7. Cool Down:
After soldering, allow the chip to cool at room ambientconditions. Using forced cool air or refrigerated air forexpediting the cooling process is not recommended and cancreate thermal shock cracks.
风华直接授权代理／片式无源器件整合供应商 【南京南山】
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For technical questions contact mlcc.specials@vishay.comDocument Number 45034
Revision 07-Sep-05
风华直接授权代理／片式无源器件整合供应商 【南京南山】
VJ Soldering Recommendations
Multilayer Ceramic Chip Capacitors
Speciality Products
Vishay Vitramon
WAVE AND REFLOW SOLDERING GRAPHSIR REFLOW WITH SnAgCu SOLDER300(°C)250300(°C)250> 215°C: 20 ~ 40 seconds200Sn-Ag-Cu solder paste200IR REFLOW WITH SnPb SOLDERTMax temperatureTMax temperature150150Min temperatureMin temperature100100Sn-Pb Eutectic solder paste5050060 ~ 120 seconds60 ~ 120 seconds30 ~ 60 sec60 ~ 120 secondstime030 ~ 60 seconds30 ~ 60 seconds30 ~ 60 secondstimeWAVE SOLDERING30010 s300REFLOW SOLDERINGT(°C)250235 °C to 260 °CT (°C)second wave250260 °C245 °C215 °C200first wave5 K/s2 K/s150200 K/s150forcedcooling130 °C200180 °C10 s10 s40 s100 °C to 130 °C1001002 K/s50502 K/s0050100150200t (s)2500050100150200t (s)250WAVE SOLDERINGVishay Vitramon offers the following recommendations:1.Set dwell time in the solder wave 2 to 3 seconds. Solder pot set at + 240 °C to + 260 °C. Belt speed at 3 to 5 feet/minute.2.Adjust Flux station (foam, spray or wave) topside preheat at + 80 °C to + 105 °C.3.Set preheat ≈ + 100 °C below the solder wave temperature. Usually maximum underside PC board temperature at last preheat zone is + 150 °C. Preheat rate should be 1.5 to 2.5 °C/second.4.Do not force cool the PC board. Maintain a uniform profile.5.Finally check that the delta difference between the solder temperature and the temperature as the PC board leaves the last preheat zone is + 100 °C or less. Chip size and mass make some types more prone to thermal shocking during the soldering operation, leading to insulation resistance (IR) failures in use.Vishay Vitramon does not recommend wave soldering for chips size 1210 (thickness ≥ 0.049\≥ 1808.REFLOW SOLDERINGThe reflow soldering process using no-clean solder paste for mounting ceramic chip capacitors has grown wide acceptance. Chip capacitors may develop thermally induced cracks if the temperature changes in reflow process are not controlled. Vishay Vitramon offers the following recommendations:1.Set peak reflow temperature at + 215 to + 260 °C based on paste melting point.2.First preheat zone temperature elevation at + 150 °C ± 10 °C, ramp rate 3 °C/second.3.Second preheat zone temperature + 150 °C ± 10 °C, ramp rate of 0.1 °C/second. Set preheat for ≤ 60 seconds. Long preheat times could cause solder balls near the capacitor/other components.4.Adjust reflow zone temperatures to + 150 °C ± 10 °C to + 225 °C ± 5 °C at ramp of 4 to 5 °C/second. Total time at reflow over + 200 °C should not exceed 15 to 20 seconds.5.Use natural cooling at the final cooling zone. Maintain a uniform profile no more than - 3 °C/second. Document Number 45034Revision 07-Sep-05
For technical questions contact mlcc.specials@vishay.comwww.vishay.com
71
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